A/D數(shù)�；旌想娐钒逶O(shè)計(jì)
來(lái)源：龍人計(jì)算機(jī)研究所 作者：站長(zhǎng) 時(shí)間：2006-11-25 09:28:53
|
Design Capabilities
- Highest layer count ：28
- High speed large digital boards
- High density digital boards
- Backplane
- Probe card
- Chip on board
- Motherboard
- High-end computing
- IPC(Industrial Personnal Computer) board
- Telecommunication boards
|
- Blind,Buried vias, Microvias and Via-in-Pad boards
- Minimum BGA pin-pith: 0.5mm
- Highest signal speed : 10 GHz differential signal
- Minimum line width ：3MIL
- Minimum via hole size ：8mil (4mil Laser drill)
|
|
Important Chips
- Intel2850、intel2800、intel 2400、intel 1200
- 英特爾服務(wù)器平臺(tái)Bensley，以及Dempesy和Woodcrest兩大系列雙核處理器
- 基于Intel 5000V芯片組的GA-7VCSV和基于Intel 5000P芯片組的GA-7BESH
- INTEL芯片組：810 815 845 865 915 945
- Motorola的PowerPC系列：MPC8260、MPC850、MPC750、MPC8272、MPC8247、MPC8245、MPC860、 MPC8241、MPC8240
- Motorola的ColdFire MCF5XXX系列（如MCF5206E）
- RMI RevA,RevB, RevC and RevD---Demo board designed by HAMPPCB
- IDT的Interprise? PCI系列（如：79RC32332）
- galileo： GT－48304、GT－48350、GT－48520等
- Broadcom 1255 1250 1125 5464、5691、5670、5690、5421
- Xilinx: Virtex II，Virtex Pro
- TI: C6415 C5561 DM642 TMS320DMXXX, DaVinci C6446芯片 等系列DSP處理器
- Marvell:98DX241、88E1145、98FX9110、98EX125
- pericom： PI7C7300等
- national： dp83815等
- Cicada Semiconductor:Cis8224、Cis8204、Cis8201
- VITESSE:VSC7303
- AMCC Chips
|
|
Design Expertise
- DDR/DDRII 800M/QDR/SRAM memory interface
- Switch Power Supply
- PCI, CPCI, PCI-X, PCIE, SATA, SATA II, XAUI
- ATCA, AMC, HyperTransport
- TI DLP-RAMBUS RDRAM
|
|
DFX Consideratios
- DFM: Design For Manufacture
- DFA: Design For Assembly
- DFT：Design For Test
- DFR：Design For Reliability
- DFC：DESIGN FOR COST
|
